A new packaging technology using micro-solder bumps for high-speed photoreceivers
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 15 (4) , 578-582
- https://doi.org/10.1109/33.159888
Abstract
No abstract availableKeywords
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