A novel flip-chip interconnection technique using solder bumps for high-speed photoreceivers
- 1 January 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Lightwave Technology
- Vol. 8 (9) , 1323-1327
- https://doi.org/10.1109/50.59160
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- A 630-mS/mm GaAs MESFET with Au/WSiN refractory metal gateIEEE Electron Device Letters, 1988
- Ultra-low-capacitance flip-chip-bonded GaInAs PIN photodetector for long-wavelength high-data-rate fibre-optic systemsElectronics Letters, 1985