Analysis of packaged microwave integrated circuits by FDTD
- 1 January 1994
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 42 (9) , 1796-1801
- https://doi.org/10.1109/22.310590
Abstract
No abstract availableKeywords
This publication has 29 references indexed in Scilit:
- Suppression of resonant modes in microwave packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Removing package effects from microstrip moment method calculationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- A full-wave electromagnetic model of cylindrical and conical via hole grounds for use in interactive MIC/MMIC designPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Simulation of interconnection and package interaction phenomena in MMIC's by FDTDPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Full-wave equivalent circuit of via-hole grounds in microstripPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1993
- Parallel FDTD simulator for microwave structuresPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1993
- Full wave analysis of propagation characteristics of a through hole using the finite-difference time-domain methodIEEE Transactions on Microwave Theory and Techniques, 1991
- Shunt posts in microstrip transmission linesIEEE Transactions on Microwave Theory and Techniques, 1990
- Damping of the resonant modes of a rectangular metal package (MMICs)IEEE Transactions on Microwave Theory and Techniques, 1989
- Absorbing Boundary Conditions for the Finite-Difference Approximation of the Time-Domain Electromagnetic-Field EquationsIEEE Transactions on Electromagnetic Compatibility, 1981