Reliability of CVD Cu buried interconnections

Publisher Website

30 December 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

https://doi.org/10.1109/iedm.1993.347355

Abstract

No abstract available

This publication has 4 references indexed in Scilit:

LPCVD profile simulation using a re-emission model
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
Copper Etching: New Chemical Approaches
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CVD Cu interconnections for ULSI
Published by Institute of Electrical and Electronics Engineers (IEEE) ,1992
High-density high-reliability tungsten interconnection by filled interconnect groove metallization
IEEE Transactions on Electron Devices, 1988