A novel mechanical shock test method to evaluate lead-free BGA solder joint reliability
- 27 July 2005
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 2, 1519-1525
- https://doi.org/10.1109/ectc.2005.1441989
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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