Electromigration behaviour and the lifetime of aluminum thin film conductors under superimposed dc and noise powers
- 16 August 1980
- journal article
- research article
- Published by Wiley in Physica Status Solidi (a)
- Vol. 60 (2) , 539-548
- https://doi.org/10.1002/pssa.2210600225
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Electromigration testing of Ti: W/Al and Ti: W/Al-Cu film conductorsThin Solid Films, 1978
- Electromigration in MetalsPublished by Elsevier ,1975
- Electromigration failure in NiCr thin-film stripesApplied Physics Letters, 1973
- Electromigration and failure in electronics: An introductionProceedings of the IEEE, 1971
- Dependence of Electromigration-Induced Failure Time on Length and Width of Aluminum Thin-Film ConductorsJournal of Applied Physics, 1970