Electromigration failure in NiCr thin-film stripes
- 1 November 1973
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 23 (9) , 496-498
- https://doi.org/10.1063/1.1654973
Abstract
Electromigration‐induced failure in NiCr thin‐film stripes is investigated. The composition of evaporated NiCr thin films is 77:23 Ni/Cr in weight %, according to a spectroscopic analysis. The mean time to failure (MTF) of NiCr thin‐film stripes can be qualitatively expressed by a relation similar to that held in the MTF of Al thin‐film stripes, i.e., MTF ∝ J−n exp(φ/kT). However, the values of n and φ of NiCr are 13 and 1.14 eV, respectively, whereas those of Al are 2 [inverted lazy s] 3 and 0.41 eV, respectively.Keywords
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