Anodic process for forming nanostructured metal-oxide coatings for large-value precise microfilm resistor fabrication
- 1 June 1999
- journal article
- Published by Elsevier in Electrochimica Acta
- Vol. 44 (21-22) , 3891-3898
- https://doi.org/10.1016/s0013-4686(99)00096-1
Abstract
No abstract availableKeywords
This publication has 11 references indexed in Scilit:
- Planar aluminum interconnection formed by electrochemical anodizing techniqueMicroelectronic Engineering, 1997
- Low-dimensional systems: quantum size effects and electronic properties of semiconductor microcrystallites (zero-dimensional systems) and some quasi-two-dimensional systemsAdvances in Physics, 1993
- EditorialApplied Physics A, 1991
- Quantum size effects on the exciton energy of CdS clustersPhysical Review B, 1990
- Electrochemical adjustment of thin film Ti-Pd resistorsThin Solid Films, 1987
- Properties of porous anodic aluminum oxide films as membranes.JOURNAL OF CHEMICAL ENGINEERING OF JAPAN, 1984
- Amorphous chromium-silicon: A material for kilo-ohm sheet resistancesThin Solid Films, 1979
- The ohmic stability and low temperature coefficient of resistance of Cu-Ni/Au-Ni multilayers obtained in ultrahigh vacuum by controlled co-evaporationThin Solid Films, 1979
- Electrical and structural properties of tantalum nitride thin films deposited by sputteringThin Solid Films, 1979
- The production of tantalum nitride film resistors using a continuous sputtering machineThin Solid Films, 1979