Atomic and ionic processes of silicon oxidation
- 7 June 2001
- journal article
- research article
- Published by American Physical Society (APS) in Physical Review B
- Vol. 63 (24) , 241304
- https://doi.org/10.1103/physrevb.63.241304
Abstract
Our state-of-the-art calculations for ionic and neutral oxygen species, both molecular and atomic, in amorphous silicon dioxide show the amorphous nature of the oxide changes significantly the energetics of defect processes like charge state change, incorporation into the oxide network, and splitup of the molecule. These changes imply a new picture of silicon oxidation in the ultrathin film regime that explains anomalies like layer-by-layer growth at terraces, roughness oscillations, the distribution of oxygen isotope incorporation, the effects of excitation, and deviations from Deal-Grove kinetics. Our results suggest possible alternative routes to improve oxide quality.Keywords
This publication has 24 references indexed in Scilit:
- Dynamics of Silicon OxidationMRS Proceedings, 1999
- Oxidation of silicon: the VLSI gate dielectricSemiconductor Science and Technology, 1995
- Periodic boundary conditions inab initiocalculationsPhysical Review B, 1995
- Growth and modeling of cw-UV induced oxidation of siliconJournal of Applied Physics, 1994
- Atoms, molecules, solids, and surfaces: Applications of the generalized gradient approximation for exchange and correlationPhysical Review B, 1992
- Dynamic observations of interface propagation during silicon oxidationPhysical Review Letters, 1992
- Direct observation of the layer-by-layer growth of initial oxide layers on Si(100) surface during thermal oxidationPhysical Review Letters, 1991
- Oxidation of siliconPhilosophical Magazine Part B, 1989
- The thermal oxidation of silicon the special case of the growth of very thin filmsAdvances in Physics, 1986
- Low-pressure oxidation of silicon stimulated by low-energy electron bombardmentPhilosophical Magazine Part B, 1985