Plastic packaging of semiconductor laser diodes
- 23 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1101-1108
- https://doi.org/10.1109/ectc.1996.550875
Abstract
Two kinds of plastic molded laser modules, the coaxial type and the board type, are developed aiming at lower cost laser modules. Under various environmental and endurance tests, these modules show potential for high reliability. The performance of these modules seem comparable to that of hermetically sealed modules used in commercial transmission systems. They are potentially suitable for low cost optical sources in transmission systems.Keywords
This publication has 7 references indexed in Scilit:
- Highly reliable non-hermetic InP-based lasers and photodiodes for telecommunicationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Degradation of InGaAsP-InP lasers in hot-humid ambients: determination of temperature-humidity-bias acceleration factorsIEEE Photonics Technology Letters, 1995
- Pigtail type laser modules entirely moulded in plasticElectronics Letters, 1995
- Spot-size converted 1.3 µm laser with butt-jointedselectively grown vertically tapered waveguideElectronics Letters, 1995
- Technology developments for low-cost laser packagingPublished by Optica Publishing Group ,1995
- A Hybrid Integrated Optical WDM Transmitter/Receiver Module for Optical Subscriber Systems Utilizing a Planar Lightwave Circuit PlatformPublished by Optica Publishing Group ,1995
- Suppression of external cavity modes in DFB lasers with a high endurance against optical feedbackIEEE Photonics Technology Letters, 1994