Chemical vapor deposition of tungsten step coverage and thickness uniformity experiments
- 1 February 1992
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 208 (2) , 177-180
- https://doi.org/10.1016/0040-6090(92)90639-s
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Maximizing step coverage during blanket tungsten low pressure chemical vapor depositionThin Solid Films, 1990
- Prediction of Step Coverage during Blanket CVD Tungsten Deposition in Cylindrical PoresJournal of the Electrochemical Society, 1990
- Chemical Vapor Deposition of Tungsten (CVD W) as Submicron Interconnection and Via StudJournal of the Electrochemical Society, 1989