Low-Pressure Chemical Vapor Deposition of Cu−Pd Films: Alloy Growth Kinetics
- 1 December 1997
- journal article
- research article
- Published by American Chemical Society (ACS) in Chemistry of Materials
- Vol. 9 (12) , 2822-2829
- https://doi.org/10.1021/cm970159j
Abstract
No abstract availableKeywords
This publication has 29 references indexed in Scilit:
- Palladium Thin Films Grown by CVD from (1,1,1,5,5,5‐Hexafluoro‐2,4‐pentanedionato) Palladium(II)Chemical Vapor Deposition, 1997
- Mechanistic Studies of Palladium Thin Film Growth from Palladium(II) β-Diketonates. 1. Spectroscopic Studies of the Reactions of Bis(hexafluoroacetylacetonato)palladium(II) on Copper SurfacesJournal of the American Chemical Society, 1996
- Synthesis and Structure Determination of (hfac)Ag(SEt2), Pd(hfac-C)(hfac-O,O)(SEt2), and [(hfac)Ag]4(SEt2): Ligand Exchange Reactions Relevant to Aerosol-Assisted Chemical Vapor Deposition (AACVD) of Ag1-xPdx FilmsInorganic Chemistry, 1995
- Aerosol-Assisted Chemical Vapor Deposition (AACVD) of Binary Alloy (AgxPd1-x, CuxPd1-x, AgxCu1-x) Films and Studies of Their Compositional VariationChemistry of Materials, 1995
- Interconnection Formation by Doping Chemical‐Vapor‐Deposition Aluminum with Copper Simultaneously: Al‐Cu CVDJournal of the Electrochemical Society, 1994
- Allyl(?-diketonato)palladium(II) complexes as precursors for palladium filmsAdvanced Materials, 1994
- Metalorganic Chemical Vapor Deposition of Aluminum-Copper Alloy FilmsJapanese Journal of Applied Physics, 1993
- Reaction pathways in organometallic chemical vapor deposition(OMCVD)Advanced Materials, 1992
- Atmospheric Pressure Chemical Vapor Deposition of Copper Thin Films: I . Horizontal Hot Wall ReactorJournal of the Electrochemical Society, 1991
- Oxidation and protection in copper and copper alloy thin filmsJournal of Applied Physics, 1991