Physical vapor deposition of chromium and titanium nitrides by the hollow cathode discharge process
- 1 October 1978
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 54 (1) , 61-65
- https://doi.org/10.1016/0040-6090(78)90277-8
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- Thin film formation of In2O3, TiN, and TaN by rf reactive ion platingJournal of Vacuum Science and Technology, 1975
- Thermal input to substrate during deposition by hollow−cathode dischargeJournal of Vacuum Science and Technology, 1975
- Ion-plated titanium carbide coatingsThin Solid Films, 1974
- Preparation of TiC Film by R.F. Reactive SputteringJournal of the Japan Institute of Metals and Materials, 1974
- Production and Measurement of Dense Metal Ions for Physical Vapor Deposition by a Hollow Cathode DischargeJapanese Journal of Applied Physics, 1974
- Fundamentals of Ion PlatingJournal of Vacuum Science and Technology, 1973
- The Effect of Substrate Temperature on the Structure of Titanium Carbide Deposited by Activated Reactive EvaporationJournal of Vacuum Science and Technology, 1972
- High Rate Ion Production for Vacuum DepositionJournal of Vacuum Science and Technology, 1972
- Investigation of Hot-Filament and Hollow-Cathode Electron-Beam Techniques for Ion PlatingJournal of Vacuum Science and Technology, 1971
- Highly Ionized Hollow Cathode DischargeJournal of Applied Physics, 1962