Abstract
Auger electron spectroscopy in an ultrahigh‐vacuum scanning electron microscope is shown capable of the direct and quantitative measurement of potential profiles across biased semiconductor junctions. Profiles are obtained with submicron spatial resolution and subvolt potential resolution by measuring shifts of an Auger electron peak across a semiconductor device as a function of surface potential and spatial position. Experimental results on a GaAs p+n junction diode for values of reverse bias between 5 and 25 V are in agreement with the potential profiles predicted by the depletion approximation model of a pn junction.

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