Cu/Photosensitive-BCB Thin-Film Multilayer Technology for High-Performance Multichip Module
- 24 August 2005
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- High Density Multilayer Substrate For Si On Si High Speed ModulePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Polymer dielectric options for thin film packaging applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003