Polymer dielectric options for thin film packaging applications
- 13 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
Several classes of available polyimide- and non-polyimide-based dielectrics have been recommended for use in thin-film substrates. A comprehensive survey of the commercially available materials considered for use in an advanced packaging program is presented. Critical physical properties of these candidate dielectrics are compared and related to their degree of compatibility with established thin-film processes.Keywords
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