Aluminum alloy film deposition and characterization
- 1 February 1974
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 20 (2) , 261-279
- https://doi.org/10.1016/0040-6090(74)90062-5
Abstract
No abstract availableKeywords
This publication has 12 references indexed in Scilit:
- Formation of second phase particles in aluminum-copper alloy filmsThin Solid Films, 1972
- A scanning electron microscope study of electromigration in an Al-2% Cu thin filmJournal of Electronic Materials, 1972
- Effect of Microstructure on the Electromigration Life of Thin-Film A1–Cu ConductorsJournal of Applied Physics, 1972
- Hillock Growth on Vacuum Deposited Aluminum FilmsJournal of Vacuum Science and Technology, 1972
- Effect of Alloy Additions on Electromigration Failures in Thin Aluminum FilmsApplied Physics Letters, 1971
- STUDY OF FAILURE MECHANISMS IN Al–Cu THIN FILMS BY HIGH-VOLTAGE ELECTRON MICROSCOPYApplied Physics Letters, 1971
- The effect of copper additions on electromigration in aluminum thin filmsMetallurgical Transactions, 1971
- Reduction of Electromigration in Aluminum Films by Copper DopingIBM Journal of Research and Development, 1970
- SLT Device Metallurgy and its Monolithic ExtensionIBM Journal of Research and Development, 1969
- Crucible Type Evaporation Source for AluminumReview of Scientific Instruments, 1966