Thermal performance of an integral immersion cooled multichip module package
- 1 January 1994
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 17 (3) , 405-412
- https://doi.org/10.1109/95.311750
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Departure from Natural Convection (DNC) in Low-Temperature Boiling Heat Transfer Encountered in Cooling Microelectronic LSI DevicesHeat Transfer Engineering, 1988
- Natural Convection Heat Transfer Characteristics of Simulated Microelectronic ChipsJournal of Heat Transfer, 1987
- Ultra-High Density VLSI ModulesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1978