Ultraviolet-induced defect creation in amorphous SiO2 exposed to an O2 plasma

Abstract
The creation of paramagnetic defects in plasma chemical vapor deposited amorphous SiO2 exposed to a rf oxygen plasma has been studied as a function of exposure time for two plasma power densities. Unpaired Si dangling bond defects (oxygen‐vacancy or oxygen‐vacancy like) have been observed in densities attaining ∼4×1017 cm3 after more than 20 min exposure. These defect levels are equivalent to 10 Mrad of 60 Co γ radiation. Ultraviolet photons in the wavelength range 250≤λ≤300 nm are shown to be responsible for the defect creation. The 130 nm O* emission is found not to be important.