Uniaxially strained silicon by wafer bonding and layer transfer
- 28 February 2007
- journal article
- Published by Elsevier in Solid-State Electronics
- Vol. 51 (2) , 226-230
- https://doi.org/10.1016/j.sse.2007.01.018
Abstract
No abstract availableKeywords
Funding Information
- Bundesministerium für Bildung und Forschung (V03110)
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