The study of plastic package cracking induced by the moisture/solder reflow process
- 13 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 445-449
- https://doi.org/10.1109/ecc.1989.77787
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow processPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Investigations of Large PLCC Package Cracking During Surface Mount ExposureIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Moisture Resistance Degradation of Plastic LSIs by Reflow SolderingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1985