Measurement of fracture stress, young's modulus, and intrinsic stress of heavily boron-doped silicon microstructures
- 1 December 1989
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 181 (1-2) , 251-258
- https://doi.org/10.1016/0040-6090(89)90492-6
Abstract
No abstract availableKeywords
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