Kinetics of Rapid Thermal Oxidation of Silicon

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Abstract
We have proposed, for the first time, a practical model for ultrathin (2 film growth in rapid thermal oxidation (RTO) kinetics. The results showed that the overall RTO growth can be well described by the linear-parabolic model proposed by Deal and Grove [J. Appl. Phys. 36 (1965) 3770]. Moreover, the model proposed indicates that in order to fit the experimental data, the oxide growth in a ramp-up process must be included in the linear-parabolic scheme. As a result, we have succeeded in explaining the RTO growth kinetics in the RTO temperature range from 950 to 1200°C and in a wide thickness range from 15 to 250 Å without making any special assumptions. The resultant activation energies for the linear rate constant (B/A) and for the parabolic rate constant (B) are 2.0 eV and 1.74 eV, respectively.