Dynamic properties of 1.3 µm semi-insulating-BHlight-emission-and-detection(LEAD)-diode module forsubscriber TCM transmission systems

Abstract
The dynamic properties of a 1.3 µm light-emission-and-detection (LEAD)-diode module that has a high mesa semi-insulating buried heterostructure (SI-BH) to reduce the capacitance of the chip (0.6–0.8 pF) are described. A modulation bandwidth of 12 GHz in laser diode (LD) operation, and detection bandwidth of ~1.9 GHz in photodetector (PD) operation are achieved using a chip and a module, respectively. In bit error rate (BER) performance at 30 Mbit/s, a receiver sensitivity (BER = 10-8) of –37.4 dBm is confirmed, and a switching time of under 1 µs from LD to PD operation is estimated using a circuit simulator.