Isothermal Fatigue of 62Sn–36Pb–2Ag Solder
- 1 January 1991
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- Fatigue life prediction of solder material: effect of ramp time, hold time and temperaturePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Isothermal Fatigue of 63Sn-37Pb SolderJournal of Electronic Packaging, 1990
- Strain-Life Behavior in 60/40 SolderJournal of Electronic Packaging, 1989
- Effect of strain rate on fatigue of low-tin lead-base solderIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Cavitation in a Pb/low-Sn solder during low cycle fatigueScripta Metallurgica, 1988
- Isothermal fatigue of low tin lead based solderMetallurgical Transactions A, 1988
- Low-Frequency, High-Temperature Low Cycle Fatigue of 60Sn-40Pb SolderPublished by ASTM International ,1988
- On fatigue life prediction under conditions of tensile holdScripta Metallurgica, 1987
- Solder Fatigue Problems in Power PackagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Fatigue: A complex subject—Some simple approximationsExperimental Mechanics, 1965