Hardness and Modulus Studies on Dielectric Thin Films

This publication has 6 references indexed in Scilit:

• X-ray diffraction determination of the effect of various passivations on stress in metal films and patterned lines
  Journal of Applied Physics, 1990
• Finite Element Calculations of Thermal Stresses in Passivated and Unpassivated Lines Bonded to Substrates
  MRS Proceedings, 1990
• The parylene-aluminum multilayer interconnection system for wafer scale integration and wafer scale hybrid packaging
  Journal of Electronic Materials, 1989
• Kinetics of structural relaxation and hydrogen evolution from plasma deposited silicon nitride
  Applied Physics Letters, 1988
• Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history
  IEEE Transactions on Electron Devices, 1987
• The relation between load and penetration in the axisymmetric boussinesq problem for a punch of arbitrary profile
  International Journal of Engineering Science, 1965