Effects of Plasma Processing Parameters on the Surface Reactivity of OH(X2Π) in Tetraethoxysilane/O2 Plasmas during Deposition of SiO2
- 1 November 1997
- journal article
- Published by American Chemical Society (ACS) in The Journal of Physical Chemistry B
- Vol. 101 (48) , 10016-10023
- https://doi.org/10.1021/jp971596o
Abstract
No abstract availableThis publication has 33 references indexed in Scilit:
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