Metallurgical changes in tin-lead platings due to heat aging
- 1 December 1991
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 14 (4) , 691-697
- https://doi.org/10.1109/33.105118
Abstract
One-inch test samples of bright and matte tin-lead platings over both copper and nickel substrates were examined after heat aging for various times at 150 degrees C in forming gas. The intermetallic compounds formed are somewhat harder and more brittle than the platings. Therefore, as the intermetallic growth approaches the outer surface of the platings, various surface properties may be altered. Generally, the coefficient of friction decreases with a corresponding increase in wearability and contact resistance. The formation of the intermetallic continues as long as there are sufficient amounts of the alloying constituents present. Samples aged to simulate a period of time for storage exhibited an increase in contact resistance when compared to as-received samples.Keywords
This publication has 5 references indexed in Scilit:
- A limited study of the effects of contact normal force, contact geometry and wipe distance on contact resistance of gold-plated contactsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Scanning Electron Microscopy and X-Ray MicroanalysisPublished by Springer Nature ,1981
- Intermetallic Growth and Contact Resistance of Tin Contacts After AgingIEEE Transactions on Parts, Hybrids, and Packaging, 1976
- The Growth of Intermetallic Compounds on Common Basis Materials Coated with Tin and Tin-Lead AlloysTransactions of the IMF, 1976
- Base Metal Contacts: An Exploratory Study of Separable Connection to Tin-LeadIEEE Transactions on Parts, Hybrids, and Packaging, 1975