Influence of Impurities and Microstructure on the Resistivity of LPCVD Titanium Nitride Films
- 1 January 1989
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- A comparative study of the diffusion barrier properties of TiN and ZrNThin Solid Films, 1986
- Chemical vapor deposition of titanium nitride at low temperaturesThin Solid Films, 1986
- Specimen preparation technique for high resolution transmission electron microscopy studies on model supported metal catalystsJournal of Microscopy, 1986
- A semiautomatic algorithm for rutherford backscattering analysisNuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 1986
- Electrical characteristics of TiN contacts to N siliconJournal of Applied Physics, 1981
- Diffusion barriers in thin filmsThin Solid Films, 1978
- Structure and Strength Effects in CVD Titanium Carbide and Titanium Nitride CoatingsJournal of the Electrochemical Society, 1976
- Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External SurfacesPhysical Review B, 1970
- Mischkristallbildung im System TiO?TiNThe Science of Nature, 1954