Influence of the additives (TU) and (PEG) on the underpotential deposition of copper on platinum electrodes: a coulometric, microgravimetric and topographic study
- 1 April 1993
- journal article
- Published by Elsevier in Electrochimica Acta
- Vol. 38 (5) , 647-652
- https://doi.org/10.1016/0013-4686(93)80233-p
Abstract
No abstract availableThis publication has 14 references indexed in Scilit:
- An in situ scanning tunnelling microscopy study of bulk copper deposition and the influence of an organic additiveJournal of Electroanalytical Chemistry, 1992
- Inhibition of the underpotential deposition of copper on single crystalline platinum surfacesJournal of Electroanalytical Chemistry, 1992
- In situ scanning tunneling microscopy of underpotential deposition of copper on platinum(111) in sulfuric acid solutionsJournal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1991
- STM Observations of the Underpotential Deposition and Stripping of Pb on Au(111) under Potential Sweep ConditionsJournal of the Electrochemical Society, 1990
- Die Quarzmikrowaage: Eine neue Meßtechnik zur in‐situ‐Untersuchung des Phasengrenzbereiches fest/flüssigAngewandte Chemie, 1990
- Transition from chemisorbed copper layers to bulk deposits on platinized platinum in sulfuric acid solutionElectrochimica Acta, 1989
- Electrochemical faceting of metal electrodesElectrochimica Acta, 1986
- Copper monolayer formation on platinum single crystal surfaces: Optical and electrochemical studiesSurface Science, 1979
- Potentiodynamic desorption spectra of metallic monolayers of Cu, Bi, Pb, Tl, and Sb adsorbed at (111), (100), and (110) planes of gold electrodesSurface Science, 1976
- Verwendung von Schwingquarzen zur W gung d nner Schichten und zur Mikrow gungThe European Physical Journal A, 1959