Site-Selective Direct Silver Metallization on Surface-Modified Polyimide Layers
- 28 October 2003
- journal article
- Published by American Chemical Society (ACS) in Langmuir
- Vol. 19 (24) , 10366-10371
- https://doi.org/10.1021/la034888r
Abstract
No abstract availableKeywords
This publication has 29 references indexed in Scilit:
- Fatigue in thin films: lifetime and damage formationMaterials Science and Engineering: A, 2001
- Cohesive failure of the Cu/polyimide systemMaterials Science and Engineering: A, 2000
- Surface Modification of Tetrafluoroethylene−Perfluoroalkyl Vinyl Ether Copolymer (PFA) by Remote Hydrogen Plasma and Surface Metallization with Electroless Plating of Copper MetalMacromolecules, 1999
- Measurement and improvement of the adhesion of copper to polyimideJournal of Materials Research, 1999
- Improved adhesion between Kapton film and copper metal by silane-coupling reactionsJournal of Applied Polymer Science, 1999
- Basic Study for Direct Metallization Using Surface Modification of Polyimide and Epoxy Resin.Journal of The Japan Institute of Electronics Packaging, 1999
- Secondary ion mass spectrometry of a copper polyimide thin film packaging technologyJournal of Vacuum Science & Technology A, 1997
- Identification of Physical and Chemical Interaction Mechanisms for the Metals Gold, Silver, Copper, Palladium, Chromium, and Potassium with Polyimide SurfacesLangmuir, 1996
- The microstructure of metal–polyimide interfacesJournal of Vacuum Science & Technology A, 1988
- Metalization of AlN Ceramics by Electroless Ni‐P PlatingJournal of the Electrochemical Society, 1986