Intermetallic compounds formation and interfacial adhesion strength of Sn–9Zn–0.5Ag solder alloy hot-dipped on Cu substrate
- 24 March 2003
- journal article
- Published by Elsevier in Journal of Alloys and Compounds
- Vol. 352 (1-2) , 168-174
- https://doi.org/10.1016/s0925-8388(02)01122-2
Abstract
No abstract availableKeywords
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