Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints
- 1 August 1998
- journal article
- Published by Elsevier in Materials Science and Engineering: B
- Vol. 55 (1-2) , 5-13
- https://doi.org/10.1016/s0921-5107(98)00202-5
Abstract
No abstract availableKeywords
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