Effects of hydrogen and deposition pressure on Si1−xGex growth rate

Abstract
Si1−xGex films were deposited at 620 °C by very low pressure chemical vapor deposition. The effects of H2 dilution and deposition pressure on Si1−xGex growth rate were examined. Under the conditions employed here, both H2 dilution and deposition pressure were found to affect the growth rate and its peak as a function of Ge incorporation in the film. The suppression of Si1−xGex growth rate from H2 at low Ge contents was observed. The growth rate enhancement by increasing deposition pressure is dependent on Ge content and becomes more significant as Ge increases. The implications of these observations for Si1−xGex growth rate are discussed.