Abstract
We report measured Ge contents and growth rates for Si1−xGex films grown by very low pressure chemical vapor deposition between 570–700 °C. The ratio of Ge/Si was found to increase linearly with increasing the ratio of GeH4 flow rate to SiH4 flow rate. The nonlinear Arrhenius behavior of growth rate as a function of Ge fraction suggests that Ge enhances hydrogen desorption and modifies the activation energy for Si1−xGex growth. The growth rates of Si1−xGex show different dependencies on Ge content at different temperatures. The growth rate decreases with increasing Ge content at 700 °C, but increases monotonically with Ge at 570 °C. A peak in growth rate was observed at intermediate temperatures between 570 and 700 °C.