Surface Modification of Polyimide Films via Plasma-Enhanced Chemical Vapor Deposition of Thin Silica and Nitride Films
- 1 July 2003
- journal article
- Published by American Chemical Society (ACS) in Langmuir
- Vol. 19 (17) , 6845-6850
- https://doi.org/10.1021/la0344074
Abstract
No abstract availableKeywords
This publication has 22 references indexed in Scilit:
- Durability of nanosized oxygen-barrier coatings on polymersProgress in Materials Science, 2003
- Surface passivation of silicon with the Plasmodul®Surface and Coatings Technology, 2001
- Low dielectric constant polymers for microelectronicsProgress in Polymer Science, 2001
- Characterization of Carbon-Doped SiO[sub 2] Low k Thin Films: Preparation by Plasma-Enhanced Chemical Vapor Deposition from TetramethylsilaneJournal of the Electrochemical Society, 2001
- SiOx Gas Barrier Coatings on Polymer Substrates: Morphology and Gas Transport ConsiderationsThe Journal of Physical Chemistry B, 1999
- Oxygen diffusion barrier properties of transparent oxide coatings on polymeric substratesSurface and Coatings Technology, 1996
- Inorganic coatings on polymersSurface and Coatings Technology, 1995
- Passivation schemes for copper/polymer thin-film interconnections used in multichip modulesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1993
- Distribution of intermediate oxidation states at the silicon/silicon dioxide interface obtained by low-energy ion implantationJournal of Vacuum Science & Technology A, 1988
- Quantitative electron spectroscopy of surfaces: A standard data base for electron inelastic mean free paths in solidsSurface and Interface Analysis, 1979