Microdielectric monitoring of prepreg cure
- 1 August 1987
- journal article
- research article
- Published by Wiley in Polymer Composites
- Vol. 8 (4) , 232-236
- https://doi.org/10.1002/pc.750080404
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Effects of stoichiometric mixing ratio on epoxy cure—a dielectric analysisPolymer Engineering & Science, 1986
- Monitoring of laminate cure with microdielectrometryPolymer Engineering & Science, 1986
- In-situMeasurement of the Properties of Curing Systems with MicrodielectrometryThe Journal of Adhesion, 1982
- Quality assurance of epoxy resin prepregs using liquid chromatographyPolymer Composites, 1980
- Characterization of thermosetting materials by torsional braid analysisPolymer Engineering & Science, 1976