High-current-density thin-film silicon diodes grown at low temperature

Abstract
High-performance thin-filmsilicon n – i – p diodes are fabricated at temperatures below 160 ° C using hot-wire chemical vapor deposition. The 0.01 mm 2 diodes have a forward current-density of near 1000 A ∕ cm 2 and a rectification ratio over 10 7 at ± 2 V . Use of microcrystalline silicon i and n layers results in higher current-density diodes than with amorphous silicon, primarily by lowering a barrier to carrier injection. A 30 nm intrinsic Si buffer layer between the i and p layers is needed to reduce the reverse leakage current. Minimizing diode area increases forward current density by reducing the voltage drop across the external series resistances.