High current post-hydrogenated chemical vapor deposited amorphous silicon p-i-n diodes

Abstract
Amorphous silicon pin diodes have been fabricated for the first time by chemical vapor deposition and post‐hydrogenation in a hydrogen plasma. By analyzing the current‐voltage characteristics we obtain current densities up to 50 A/cm2 and rectification ratios better than 107 for 3‐V applied bias. A characteristic reversible breakdown voltage is observed up to voltages of ∼20 V. These results are compared with those obtained on amorphous silicon pin diodes prepared by glow discharge decomposition of SiH4.