Distribution of irradiation damage in silicon bombarded with hydrogen

Abstract
Damage distribution in [001] silicon crystals bombarded with a fluence of 1016/cm2 to 1017 cm2 H+ ions at 50-250 keV and at implantation temperatures from -170 to 600°C was measured by use of high-energy He+4 channeling. The depth profiles were verified by spreading-resistivity measurements, by radiation-enhanced diffusion measurements, and by sectioning of a sample on which blisters had formed. The hydrogen profile, measured by N15(p,αγ)C12 reaction, agrees with the damage distribution. For 200 keV the depth measurements agree with values calculated by theoretical methods, and the depth distribution is 30%-60% narrower.