Low‐temperature poly‐Si TFT transferred onto plastic substrates by using surface free technology by laser ablation/annealing (SUFTLA®)

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Abstract
—: A novel technology that makes it possible to transfer electronic devices from an original substrate to another substrate is introduced. Because laser irradiation is utilized during the transfer process, this technology was named SUFTLA® (surface free technology by laser ablation/annealing). Low‐temperature poly‐Si TFTs first manufactured on a quartz substrate were transferred onto a PES substrate without any damage or characteristic degradation. A trial TFT‐LCD device with peripheral integrated driver circuits was also transferred onto the PES substrate and their operation was observed under typical conditions. These results indicate that the SUFTLA technology is one of the leading candidates for fine‐patterned high‐performance electronic‐device manufacturing on flexible substrate.

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