Anomalies in the lattice parameters and residual stress of coatings made by physical vapor deposition methods
- 30 April 1990
- journal article
- Published by Elsevier in Surface and Coatings Technology
- Vol. 41 (2) , 231-241
- https://doi.org/10.1016/0257-8972(90)90171-8
Abstract
No abstract availableKeywords
This publication has 28 references indexed in Scilit:
- High-temperature x-ray diffraction studies on physical vapour deposited TiNSurface and Coatings Technology, 1989
- Low temperature tempering-induced changes in bulk resistivity, temperature coefficient of resistivity and stress in physically vapor-deposited TiNSurface and Coatings Technology, 1988
- On the existence of point defects in physical vapor deposited films of TiN, ZrN, and HfNJournal of Vacuum Science & Technology A, 1988
- Electron microscopy study of sputtered NbN filmsUltramicroscopy, 1987
- Low-energy ion irradiation during film growth for reducing defect densities in epitaxial TiN(100) films deposited by reactive-magnetron sputteringJournal of Applied Physics, 1987
- Effect of energetic neutralized noble gas ions on the structure of ion beam sputtered thin metal filmsJournal of Vacuum Science & Technology A, 1987
- Internal Stress and Microstructure of Titanium Nitride CoatingsSurface Engineering, 1987
- Variations in the colour of group IV B nitride filmsVacuum, 1986
- The effects of hydrogen partial pressure on reactively sputtered amorphous siliconJournal of Applied Physics, 1984
- Internal stresses in titanium, nickel, molybdenum, and tantalum films deposited by cylindrical magnetron sputteringJournal of Vacuum Science and Technology, 1977