Single crystal silicon thin film transistors fabricatedat low process temperatureson glass substrates
- 11 April 1996
- journal article
- Published by Institution of Engineering and Technology (IET) in Electronics Letters
- Vol. 32 (8) , 775-777
- https://doi.org/10.1049/el:19960474
Abstract
Thin film transistors were fabricated in single crystal silicon films bonded to glass substrates. High electron mobilities were achieved, making integration of the driving circuitry and pixel switching elements on the same glass substrate possible and allowing improved display aperture ratios. These single crystal silicon TFTS are attractive for AMLCD applications.Keywords
This publication has 5 references indexed in Scilit:
- Investigation of silicon interstitial reactions with insulating films using the silicon wafer bonding techniqueApplied Physics Letters, 1993
- Fabrication and Bonding Strength of Bonded Silicon-Quartz WafersJapanese Journal of Applied Physics, 1993
- High-performance thin-film transistors in low-temperature crystallized LPCVD amorphous silicon filmsIEEE Electron Device Letters, 1987
- A technology for high-performance single-crystal silicon-on-insulator transistorsIEEE Electron Device Letters, 1987
- Polycrystalline silicon thin-film transistors on a novel 800°C glass substrateIEEE Electron Device Letters, 1986