On the energy influx to the substrate during sputter deposition of thin aluminium films
- 1 November 1998
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 332 (1-2) , 282-289
- https://doi.org/10.1016/s0040-6090(98)01067-0
Abstract
No abstract availableKeywords
This publication has 12 references indexed in Scilit:
- Thermal power at a substrate during ZnO:Al thin film deposition in a planar magnetron sputtering systemJournal of Applied Physics, 1997
- Ion energy distributions in a dc biased rf dischargeJournal of Applied Physics, 1997
- Nonlinearity of the radio-frequency sheathJournal of Applied Physics, 1996
- Investigation of the Plasma of a Magnetron Discharge during Titanium DepositionContributions to Plasma Physics, 1995
- Investigation of the energy transfer to the substrate during titanium deposition in a hollow cathode arcJournal of Vacuum Science & Technology A, 1994
- Reflection of heavy ionsZeitschrift für Physik B Condensed Matter, 1986
- Modelling ion-assisted deposition of CeO2 filmsApplied Physics A, 1986
- Substrate heating rates for planar and cylindrical-post magnetron sputtering sourcesThin Solid Films, 1984
- Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatingsJournal of Vacuum Science and Technology, 1974
- The influence of the scattering law on the radiation damage displacement cascade. IIPhilosophical Magazine, 1968