Redistribution of Fe and Ti implanted into InP
- 1 September 1991
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 70 (5) , 2604-2609
- https://doi.org/10.1063/1.349370
Abstract
The redistribution of Fe and Ti implanted into InP and its recrystallization is studied using various thermal annealing techniques. Fe and Ti profiles are measured by secondary-ion mass spectroscopy and recrystallization by Rutherford backscattering channeling. Ti shows absolutely superior thermal stability under any circumstances as compared to Fe. Iron always accumulates at the surface and at a depth of approximately twice the projected range Rp. After high-dose implantation Fe additionally accumulates in the 0.8Rp region. At similar doses Ti still shows no diffusion and only faint accumulation between the surface and Rp.This publication has 35 references indexed in Scilit:
- Effects of background Fe concentrations in the annealing of ion-implanted Si into InP substrates for InP metal-insulator-semiconductor field-effect transistor applicationsJournal of Applied Physics, 1989
- Implant-induced high-resistivity regions in InP and InGaAsJournal of Applied Physics, 1989
- Semi-insulating properties of Fe-implanted InP. I. Current-limiting properties of n+-semi-insulating-n+ structuresJournal of Applied Physics, 1985
- Transition-metal impurities in III-V compoundsJournal of Physics C: Solid State Physics, 1985
- Redistribution of Fe in thermally annealed semi-insulating InP(Fe): Determination of Fe diffusion coefficient in InPJournal of Applied Physics, 1984
- Channeled substrate buried heterostructure InGaAsP/InP laser employing a buried Fe ion implant for current confinementApplied Physics Letters, 1984
- Iron and Chromium Redistribution in Semi‐Insulating InPJournal of the Electrochemical Society, 1981
- The electrical characteristics of ion implanted compound semiconductorsNuclear Instruments and Methods, 1981
- Redistribution of Fe in InP during liquid phase epitaxyJournal of Applied Physics, 1981
- High-resistivity layers in n-InP produced by Fe ion implantationSolid-State Electronics, 1978