Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperature
- 1 May 1994
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 43 (1-3) , 223-229
- https://doi.org/10.1016/0924-4247(93)00653-l
Abstract
No abstract availableKeywords
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