Statistics of solder joint alignment for optoelectronic components
- 1 January 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 16 (5) , 527-529
- https://doi.org/10.1109/33.239883
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Packaging for a 1 Gb/s OEIC fiber-optic data linkPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- An innovative bonding technique for optical chips using solder bumps that eliminate chip positioning adjustmentsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992
- Area Array Solder Joints for Passive AlignmentMRS Proceedings, 1992
- Self-aligned flip-chip assembly of protonic devices with electrical and optical connectionsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990