3.2 The electromechanical behaviour of a full component (dielectric and Cu/Ni constantan alloy) for thin film strain gauge deposited upon steel-substrate
- 30 June 1977
- Vol. 27 (4) , 363-365
- https://doi.org/10.1016/0042-207x(77)90024-0
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Temperature and thickness dependence of the Ohmic and thermoelectric behaviour of Cu-Ni thin films of constantan type obtained by controlled UHV co-evaporationThin Solid Films, 1976
- The relaxation of the elastoresistance of thin metallic filmsThin Solid Films, 1976
- The electromechanical properties of thin films and the thin film strain gaugeThin Solid Films, 1974
- Size effect in strain coefficient of resistivityThin Solid Films, 1970
- Anomalous High Strain Sensitivity of CdS Evaporated FilmsJapanese Journal of Applied Physics, 1965
- Evaporated film strain gauges for high-temperature applicationsMicroelectronics Reliability, 1964
- Electrical Resistance-Strain Characteristics of Thin Evaporated Metal FilmsJournal of Applied Physics, 1963