Study of conductive gold film lifetime under high current densities
- 1 April 1975
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 46 (4) , 1455-1458
- https://doi.org/10.1063/1.321794
Abstract
The lifetimes of gold films were measured at electrical current densities of (0.8−1.15) ×106 A/cm2 and temperatures of 220−500 °C. The effective activation energy was found to be 0.42 eV. Electromigration caused the formation of voids, hillocks, and whiskers. All films failed near the cathode, suggesting that gold atoms migrate in the direction of electron flow. The film lifetime is governed both by the temperature gradients and local structural changes. An approximate equation which takes into account these effects was derived to evaluate the film lifetimes.This publication has 5 references indexed in Scilit:
- Electromigration and metalization lifetimesJournal of Applied Physics, 1973
- Electromigration in Aluminum Film Stripes Coated with Anodic Aluminum Oxide FilmsJapanese Journal of Applied Physics, 1973
- Electromigration Damage in Aluminum Film ConductorsJournal of Applied Physics, 1970
- Electromigration—A brief survey and some recent resultsIEEE Transactions on Electron Devices, 1969
- Current-induced marker motion in gold wiresJournal of Physics and Chemistry of Solids, 1961