Distribution of dopant in SiO2-Si

Abstract
The distribution of dopant in SiO2‐Si during dry thermal oxidation and postoxidation anneal is studied. Analytical expressions for the distribution functions are derived, on the assumptions that the oxide film grows in accordance with the t1/2 law and that before oxidation the dopant is uniformly distributed in the silicon. Cases in which tnt1/2 are discussed, with particular attention to the effect of n≳1/2 on the distribution of the dopant in the oxide. Calculations are provided for boron, describing its distribution in the oxide and in the silicon as a function of postoxidation anneal. Some experimental results concerning the distribution of boron in the silicon are provided for various oxide thicknesses, oxidation temperatures, and anneal times. These results were obtained from spreading‐resistance measurements.

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